S. Merugu, J. Sharma, Sagnik Ghosh, Yul Koh, A. Lal, E. Ng
{"title":"A Novel Fabrication Platform for Acceleration Sensor Switch with Top Contacts","authors":"S. Merugu, J. Sharma, Sagnik Ghosh, Yul Koh, A. Lal, E. Ng","doi":"10.1109/Transducers50396.2021.9495431","DOIUrl":null,"url":null,"abstract":"This report describes a novel microfabrication platform to realize an acceleration sensor switch with top contacts in the out-of-plane direction. The platform utilizes conventional micromachining processes on 8″ silicon wafers. The acceleration switch top contacts are realized with a composite structure of an Al bridge spring, hardened at the contact locations with TiN, in order to provide robustness while allowing some compliance for a prolonged contact time and minimal bouncing effects. The silicon proof mass is also hardened at the contact locations with TiN. The fabricated acceleration sensor switch is demonstrated to have a threshold of under 40g, which is well-suited for IoT applications.","PeriodicalId":6814,"journal":{"name":"2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)","volume":"24 1","pages":"124-127"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/Transducers50396.2021.9495431","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This report describes a novel microfabrication platform to realize an acceleration sensor switch with top contacts in the out-of-plane direction. The platform utilizes conventional micromachining processes on 8″ silicon wafers. The acceleration switch top contacts are realized with a composite structure of an Al bridge spring, hardened at the contact locations with TiN, in order to provide robustness while allowing some compliance for a prolonged contact time and minimal bouncing effects. The silicon proof mass is also hardened at the contact locations with TiN. The fabricated acceleration sensor switch is demonstrated to have a threshold of under 40g, which is well-suited for IoT applications.