Y. Liu, L. Pu, Y. Yang, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. Tu
{"title":"A high-entropy alloy as very low melting point solder for advanced electronic packaging","authors":"Y. Liu, L. Pu, Y. Yang, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. Tu","doi":"10.1016/j.mtadv.2020.100101","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":8423,"journal":{"name":"arXiv: Applied Physics","volume":"91 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2020-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"arXiv: Applied Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.mtadv.2020.100101","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
