Alloyed High-k-Based Resistive Switching Memory in Contact Hole Structures

B. Kim, C. Mahata, Hojeong Ryu, M. Ismail, Byung‐Do Yang, Sungjun Kim
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引用次数: 4

Abstract

Resistive random-access memory (RRAM) devices are noticeable next generation memory devices. However, only few studies have been conducted regarding RRAM devices made of alloy. In this paper, we investigate the resistive switching behaviors of an Au/Ti/HfTiOx/p-Si memory device. The bipolar switching is characterized depending on compliance current under DC sweep mode. Good retention in the low-resistance state and high-resistance state is attained for nonvolatile memory and long-term memory in a synapse device. For practical switching operation, the pulse transient characteristics are studied for set and reset processes. Moreover, a synaptic weight change is achieved by a moderate pulse input for the potentiation and depression characteristics of the synaptic device. We reveal that the high-resistance state and low-resistance state are dominated by Schottky emissions.
接触孔结构中的合金高基电阻开关存储器
电阻式随机存取存储器(RRAM)是引人注目的下一代存储器。然而,关于合金材料的RRAM器件的研究很少。本文研究了Au/Ti/HfTiOx/p-Si存储器件的电阻开关行为。双极开关的特性取决于直流扫描模式下的顺应电流。对于突触装置中的非易失性记忆和长时记忆,在低电阻状态和高电阻状态下获得良好的保持。在实际的开关操作中,研究了设置和复位过程的脉冲瞬态特性。此外,通过为突触装置的增强和抑制特性提供适度的脉冲输入来实现突触重量的变化。我们发现高阻态和低阻态以肖特基辐射为主。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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