Advantages of embedded decoupling capacitance in high speed compact board design

Abstract

This paper provides an introduction about embedded capacitance technology and its implementation on printed circuit board (PCB). The advantages of implementing embedded decoupling capacitance in compact PCB with high speed signal transmission are also explained. The advantages in terms of power and signal integrity are discussed in detail by performing analysis in 2 phases. In phase one, the computation of power distribution network (PDN) impedance of the conventional PCB with discrete decoupling capacitors and the PCB with embedded decoupling capacitance is performed. Meanwhile in phase two, co-analysis of power and signal integrity (PI/SI) on test cases with decoupling conditions mentioned in phase one is conducted to observe the power rail noise and quality of signal transmission. The analysis results are further discussed in the later section of this paper.