{"title":"Technology for passive integration","authors":"M. De Samber, L. Tegelaers","doi":"10.1016/S0165-5817(98)00014-X","DOIUrl":null,"url":null,"abstract":"<div><p>The technology as used for passive integration is discussed. The build-up of passive components (integrated resistors, capacitors, and inductors, including interconnect) and the (eventually) following mounting and assembly technologies are described. The adaptations of the basic technology are described using a number of demonstrator examples from different application fields. Depending on these application areas, different constraints are valid. This is often related to the working frequencies of the devices and the modules, or the extra assembly of active components. Some results on the material characteristics are discussed, but the emphasis is on the description of technology.</p></div>","PeriodicalId":101018,"journal":{"name":"Philips Journal of Research","volume":"51 3","pages":"Pages 389-410"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/S0165-5817(98)00014-X","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Philips Journal of Research","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S016558179800014X","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
The technology as used for passive integration is discussed. The build-up of passive components (integrated resistors, capacitors, and inductors, including interconnect) and the (eventually) following mounting and assembly technologies are described. The adaptations of the basic technology are described using a number of demonstrator examples from different application fields. Depending on these application areas, different constraints are valid. This is often related to the working frequencies of the devices and the modules, or the extra assembly of active components. Some results on the material characteristics are discussed, but the emphasis is on the description of technology.
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