Thermal pyrolytic graphite composite with coefficient of thermal expansion matching for advanced thermal management

Abstract

As demonstrated in this study, bonding TPG with CTE-matched alloys, such as MoCu, simultaneously achieves high thermal conductivity (TC > 900 W/m-K) and low coefficient of thermal expansion (CTE < 9×10−6/K). The TC and CTE measurements as a function of TPG loadings on the TPG-MoCu composites match the theoretical calculation. Compared with the traditional 2-component architecture, heat spreaders made of this TPG composite not only increase the efficiency of thermal spreading, but also eliminate one thermal interface and reduce the integration cost.