3D modelling of a thermopile-based SOI CMOS thermal wall shear stress sensor

Abstract

This paper presents a multiphysic 3-D model of an SOI CMOS MEMS thermal wall shear stress sensor obtained using “Comsol Multiphysics”. It includes all the physical domains involved and their interaction. After a brief introduction, the device is presented and its working principle explained. The numerical model and the validation process are then described.