Treatment of ammoniacal copper etchants

J. Melling
{"title":"Treatment of ammoniacal copper etchants","authors":"J. Melling","doi":"10.1016/0166-3097(86)90021-0","DOIUrl":null,"url":null,"abstract":"<div><p>Ammoniacal ammonium chloride etchants are widely used to etch copper during the manufacture of printed circuit board (PCBs). Etching efficiency declines above 110 to 130 g/L copper and this concentration must be restored once the concentration reaches 150 to 170 g/L copper. The annual European arising of spent etchant (about half the U.S.A. arising) is estimated to contain 2250 Mg copper. Disposal of spent etchant involves a loss of resources and is usually environmentally unacceptable. This paper reviews methods for the regeneration of spent etchants with co-recovery of a saleable copper product. Whilst large volume flows of spent etchant are regenerated commercially, there is a need for methods appropriate to on-site treatment by the smaller PCB producer. Experimental developments designed to meet this need, using either supported liquid membranes impregnated with a diketone extractant or an electrochemical cell divided by solid ion exchange membrane, are described. The performance of the ion exchange membranes tested in the membrane cell was found to be inadequate for this application. It is concluded that a supported liquid membrane process, after further development, in combination with copper electrowinning from an acidic solution may fulfil the need for on-site treatment by the smaller PCB producer.</p></div>","PeriodicalId":101079,"journal":{"name":"Resources and Conservation","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1986-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0166-3097(86)90021-0","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Resources and Conservation","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0166309786900210","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

Ammoniacal ammonium chloride etchants are widely used to etch copper during the manufacture of printed circuit board (PCBs). Etching efficiency declines above 110 to 130 g/L copper and this concentration must be restored once the concentration reaches 150 to 170 g/L copper. The annual European arising of spent etchant (about half the U.S.A. arising) is estimated to contain 2250 Mg copper. Disposal of spent etchant involves a loss of resources and is usually environmentally unacceptable. This paper reviews methods for the regeneration of spent etchants with co-recovery of a saleable copper product. Whilst large volume flows of spent etchant are regenerated commercially, there is a need for methods appropriate to on-site treatment by the smaller PCB producer. Experimental developments designed to meet this need, using either supported liquid membranes impregnated with a diketone extractant or an electrochemical cell divided by solid ion exchange membrane, are described. The performance of the ion exchange membranes tested in the membrane cell was found to be inadequate for this application. It is concluded that a supported liquid membrane process, after further development, in combination with copper electrowinning from an acidic solution may fulfil the need for on-site treatment by the smaller PCB producer.

氨态铜腐蚀剂的处理
氨性氯化铵蚀刻剂广泛用于印刷电路板(pcb)的蚀刻。当铜浓度达到150 ~ 170 g/L时,蚀刻效率必须恢复到110 ~ 130 g/L。据估计,欧洲每年产生的废蚀刻剂(约占美国的一半)含有2250毫克铜。废蚀刻剂的处置涉及资源损失,通常在环境上是不可接受的。本文综述了废蚀刻剂再生和一种可售铜产品共回收的方法。虽然大量的废蚀刻剂可在商业上再生,但小型PCB生产商需要适合于现场处理的方法。本文描述了为满足这一需求而设计的实验发展,使用浸渍有二酮萃取剂的支撑液体膜或由固体离子交换膜分隔的电化学电池。在膜细胞中测试的离子交换膜的性能发现不适合这种应用。结论是,在进一步发展后,支持液膜工艺与酸性溶液中的铜电积相结合,可以满足小型PCB生产商现场处理的需要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信