Preparation of feedstock containing water-soluble binder for powder injection moulding of silver

IF 0.7 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
C. Aumnate, Nithiwach Nawaukkaratharnant, N. Chuankrerkkul
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引用次数: 1

Abstract

Feedstock for powder injection moulding of silver was prepared using water-soluble binder composed of polyethylene glycol (PEG) and polyvinyl butyrol (PVB). Silver powders with particle size in range of 1 μm to 20 μm can be mixed with PEG/PVB binder system to form feedstocks having powder loadings of 42 vol% and 45 vol%. PEG can be removed using water leaching method while PVB can be removed by thermal debinding. Specimens retained their shapes during debinding and after debinding. Components fabricated with relatively higher powder loading resulted in higher density with lower porosity. Density of specimens containing powder loading of 42 vol% and 45 vol% and heated at 700℃ is about 43% and 46% of the theoretical value, respectively. Therefore, it can be further developed for porous materials applications.
银粉末注射成型用水溶性粘结剂原料的制备
采用聚乙二醇(PEG)和聚乙烯醇(PVB)组成的水溶性粘结剂制备了银粉末注射成型的原料。粒径范围为1 μm ~ 20 μm的银粉可与PEG/PVB粘结剂体系混合,形成粉末负荷量为42 vol%和45 vol%的原料。PEG可采用水浸法去除,PVB可采用热脱脂法去除。试样在去胶过程中和去胶后均保持原状。用相对较高的粉末负荷制造的组件导致密度更高,孔隙率更低。掺粉量为42 vol%和45 vol%的试样在700℃加热时的密度分别约为理论值的43%和46%。因此,它可以进一步发展为多孔材料的应用。
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来源期刊
Journal of metals, materials and minerals
Journal of metals, materials and minerals MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
1.40
自引率
11.10%
发文量
0
期刊介绍: Journal of Metals, Materials and Minerals (JMMM) is a double-blind peer-reviewed international journal published 4 issues per year (starting from 2019), in March, June, September, and December, aims at disseminating advanced knowledge in the fields to academia, professionals and industrialists. JMMM publishes original research articles as well as review articles related to research and development in science, technology and engineering of metals, materials and minerals, including composite & hybrid materials, concrete and cement-based systems, ceramics, glass, refractory, semiconductors, polymeric & polymer-based materials, conventional & technical textiles, nanomaterials, thin films, biomaterials, and functional materials.
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