Copper Electrodeposition by Hydrogen Evolution Assisted Electroplating (HEA) for Wearable Electronics

Abstract

A novel technique called hydrogen evolution assisted (HEA) electroplating, has dramatically shown enhancement to the deposition rate of copper compared to galvanostatic conventional electroplating methods, opening new venues for the direct integration of devices to fabrics leading to the development of useful wearable electronics. HEA can be used for both printing copper tracks on a multi-wall carbon nanotubes (MWCNTs) coated template tracks and soldering surface mount electronic devices (SMD) to such tracks, demonstrating its versatility to be used for specific applications in which fabric mutilation wants to be prevented. However, in this project we studied how copper deposition takes place at different voltage ranges using 1000 Denier Coated Cordura Nylon, Laminated Polyester Ripstop and 100% Virgin Vinyl in the constant presence of the hydrogen evolution technique. Cupric sulfate (CUSO4) and sulfuric acid (H2SO4) were used as the medium to allow a lateral deposition over a multi-wall carbon nanotube track of 0.1mm by the application of a voltage ranging between - 0.5V to −2.0V using a potentiostat to employ the cyclic voltammeter technique in order to achieve a uniform deposition. Structure of the fabrics and variation of the copper deposits with respect to the type of fabric used were observed using a scanning electron microscopy (SEM).