Design of 850 GHz 2×2 Array Heterodyne-receiver Chips Based on Schottky-diode GaAs Process

Shuoxing Li, Xiao Wang, Meng Zhang, Yan-Jiao Hu, Lu Tang, Han Wang
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Abstract

This paper introduces the design and implementation of array heterodyne-receiver chips working at 850GHz. For the designing process of high-integrated array chips, the parasitic effect is one of the major difficulties. To reduce the influence of parasitic effect, the mixer is designed to utilize a parallel diode which simplifies the direct-current bias circuit, LO is designed to adopt a direct nine-fold multiplier chain. As a result, array monolithic chips in symmetrical $2 \times2$ form have high integration and low noise figure. The simulation results prove the rationality, correctness, and feasibility of the design, which has reference significance for the engineering research of terahertz domain.
基于肖特基二极管GaAs工艺的850 GHz 2×2阵列外差接收机芯片设计
本文介绍了工作在850GHz频段的阵列外差接收机芯片的设计与实现。在高集成度阵列芯片的设计过程中,寄生效应是主要的难点之一。为了减少寄生效应的影响,混频器设计采用并联二极管,简化了直流偏置电路,LO设计采用直接九倍乘法链。因此,对称$2 \times2$形式的阵列单片芯片具有高集成度和低噪声系数。仿真结果证明了该设计的合理性、正确性和可行性,对太赫兹领域的工程研究具有参考意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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