Establishment and Analysis of a New Type of TSV Equivalent Circuit Model

Lei Pan, Zewei Li, Binbin Xu, Luzhou Liu, Zhikuang Cai, Jian Xiao
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Abstract

Based on a new type of coaxial ring-tapered TSV structure, an equivalent circuit model of this structure is constructed in this paper to analyze the transmission characteristics. S11 and S21 are obtained with the geometric model and equivalent circuit model simulated by HFSS and ADS respectively. The experimental results show that the two models have a good fitting effect: in the range of 0-40 GHz, the maximum error of S11 is within 8 %; and the maximum error of S21 is within 5 %, which verifies the correctness of the equivalent circuit model. The specific effects of each parasitic parameter on S11 is found that the silicon substrate capacitance has a great impact on high frequency, and Sll can be increased by 0.15 dB with only 1 fF silicon substrate capacitance, and the remaining parasitic parameters have a small impact on S11.
一种新型TSV等效电路模型的建立与分析
基于一种新型同轴环锥TSV结构,建立了该结构的等效电路模型,对其传输特性进行了分析。分别用HFSS和ADS仿真的几何模型和等效电路模型得到了S11和S21。实验结果表明,两种模型均具有良好的拟合效果:在0 ~ 40 GHz范围内,S11的最大误差在8%以内;S21的最大误差在5%以内,验证了等效电路模型的正确性。各寄生参数对S11的具体影响发现,硅衬底电容对高频影响较大,仅1 fF硅衬底电容即可使Sll提高0.15 dB,其余寄生参数对S11的影响较小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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