Towards Control of Band Gap in Two-Dimensional Hexagonal Boron Nitride by Doping

S. Rashkeev, Merid Legesse, H. Saidaoui, Fedwa El Mcllouhi, S. Ahzi, F. Alharbi
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引用次数: 1

Abstract

Recently boron nitride received a lot of attention due to its applications in optoelectronic devices, composites, and biological materials. In particular, it was proved to be useful as supporting substrates and gate dielectric layers in graphene-based structures. We performed first-principles calculations for aluminum doped two-dimensional (2D) hexagonal boron nitride (h-BN) layers. We found that the band gap strongly depends on Al concentration and increasing Al concentration diminishes the electronic band gap due to the formation of intermediate states in the h-BN gap. For Al concentration of 12.5%, the electronic band gap becomes 4.1 eV compared to 5.97 eV in the original undoped h-BN material. Such a significant band gap reduction makes this material promising for using in different UV optoelectronic and high-power electronic devices. We also statistically analyzed how interatomic distances between substitutional Al defects in this materials affect the value of the band gap. We found that the position of corresponding intermediate bands strongly depends on the interatomic distances between the substitutional defects. We also studied the statistical band gap distribution in doped boron nitride. In particular, we show that increasing concentration of Al substitutional defects in Al-doped h-BN increases the thermodynamic stability of the system which is also favorable for using heavily doped boron nitride in optoelectronic devices.
掺杂控制二维六方氮化硼带隙的研究
近年来,氮化硼在光电器件、复合材料和生物材料等方面的应用受到了广泛的关注。特别是,它被证明是有用的支撑衬底和栅极介电层在石墨烯基结构。我们对铝掺杂二维六方氮化硼(h-BN)层进行了第一性原理计算。我们发现带隙强烈依赖于Al的浓度,并且由于在h-BN隙中形成中间态,Al浓度的增加减小了电子带隙。当Al浓度为12.5%时,电子带隙变为4.1 eV,而未掺杂h-BN材料的电子带隙为5.97 eV。如此显著的带隙减小使得该材料有望用于不同的紫外光电和高功率电子器件。我们还统计分析了该材料中取代Al缺陷之间的原子间距离如何影响带隙值。我们发现相应的中间能带的位置强烈依赖于取代缺陷之间的原子间距离。我们还研究了掺杂氮化硼的统计带隙分布。特别是,我们发现Al掺杂h-BN中Al取代缺陷浓度的增加增加了体系的热力学稳定性,这也有利于在光电器件中使用重掺杂氮化硼。
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