Soldering of Sensitive Components by Screen Method and Surface Mounting

Abstract

This report presents a new method for soldering of heat-sensitive elements. The main path to solving this issue is the use of lower temperature soldering pastes, corresponding reflow temperature profiles and shorter soldering times. However, when the rest of the scheme does not require this, or a standard reflow profile is required, the sensitive components are also manually installed. The essence of the presented method is to use additional heat screens placed over the sensitive components. The screens can be placed either manually or by machine. The screens themselves are analogous to surface mounting elements and can be of different heat mass. Experimental results of temperature profile change using thermal screens are presented.