Chau Yuen, Chongwen Huang, I. Akyildiz, M. D. Renzo, M. Debbah
{"title":"Guest Editorial: Intelligent Surfaces for 5G and Beyond","authors":"Chau Yuen, Chongwen Huang, I. Akyildiz, M. D. Renzo, M. Debbah","doi":"10.1109/mwc.2021.9690146","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13497,"journal":{"name":"IEEE Wirel. Commun.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Wirel. Commun.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/mwc.2021.9690146","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}