Atomistic modeling of the thermoelectric power factor in ultra-scaled Silicon nanowires

A. Paul, Gerhard Klimeck
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引用次数: 1

Abstract

Dimensional scaling provides an alternative route to improve the thermoelectric figure of merit (ZT) by the reduction of the lattice thermal conductivity(кl). However, this method is reaching the scaling limit. Further improvement in ZT can be achieved by improving the thermoelectric power-factor (S2G), the numerator of ZT. In this work we study this part of ZT using a combination of semi-empirical Tight-Binding method and Landauer approach. We study the effect of cross-sectional confinement, wire orientation and uniaxial strain on the power-factor (PF). It is found that any improvement in PF is only achieved for wires with cross-section size less than 6nm × 6nm.
超尺度硅纳米线热电功率因数的原子模型
尺寸缩放提供了另一种途径,通过降低晶格导热系数来提高热电性能值(ZT) (кl)。然而,这种方法正在达到缩放极限。进一步改善ZT可以通过提高ZT分子热电功率因数(S2G)来实现。在这项工作中,我们使用半经验紧密结合方法和Landauer方法的组合来研究ZT的这一部分。研究了截面约束、导线取向和单轴应变对功率因数的影响。研究发现,只有在截面尺寸小于6nm × 6nm的线材上,PF才能得到改善。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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