D-Band Antenna and Array Designs for 5G Applications

公共管理高层论坛 Pub Date : 2023-06-06 DOI:10.1109/EuCNC/6GSummit58263.2023.10188240

A. Lamminen, M. Kaunisto, J. Säily, M. Kantanen, Mario Schober, Alberto Chico, J. Ala-Laurinaho, V. Ermolov

引用次数: 0

Abstract

This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

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面向5G应用的d波段天线和阵列设计

本文介绍了一种针对5G应用的寄生贴片微带d波段天线和一种基于多层印刷电路板(PCB)的16元分段天线阵列的设计、制造和表征。天线采用印刷电路板技术，在多层衬底上采用半增材加工(mSAP)的导体制造。在157 GHz频率下，单天线和16元阵列的最大增益分别为9 dBi和16.5 dBi。测得的天线阵列输入匹配带宽为20 GHz。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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公共管理高层论坛

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