A 45nm SOI embedded DRAM macro for POWER7TM 32MB on-chip L3 cache

J. Barth, D. Plass, E. Nelson, C. Hwang, G. Fredeman, M. Sperling, A. Mathews, W. Reohr, Kavita Nair, N. Cao
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引用次数: 33

Abstract

Logic-based embedded DRAM has matured into a wide range of ASIC applications, SRAM replacements [1] and off-chip caches for microprocessors [2]. While embedded DRAM has been leveraged in supercomputers such as IBM's BlueGene/L [3], it's use has been limited to moderate performance bulk logic technologies. Although prototypes have been demonstrated [4], DRAM has yet to be embedded on a high performance microprocessor. This paper discloses an SOI DRAM macro implemented on-chip with the IBM POWER7™ high performance microprocessor [5], and introduces enhancements to the micro sense amp (µSA) architecture [6]. This high performance DRAM macro is used to construct a large 32MB L3 cache on-chip, eliminating delay, area and power from the off-chip interface, simultaneously improving system performance, reducing cost, power and soft error vulnerability. Figure 19.1.1a shows an SEM of the 45nm SOI DRAM Device and Deep Trench (DT) capacitor [7]. DT offers 25x more capacitance than planar structures and was also utilized to reduce on-chip voltage island supply noise.
一个45nm SOI嵌入式DRAM宏,用于POWER7TM 32MB片上L3高速缓存
基于逻辑的嵌入式DRAM已经成熟到广泛的ASIC应用,SRAM替代品[1]和微处理器的片外缓存[2]。虽然嵌入式DRAM已经被用于超级计算机,如IBM的BlueGene/L[3],但它的使用仅限于中等性能的批量逻辑技术。虽然原型已经被证明[4],DRAM还没有被嵌入到高性能微处理器上。本文公开了一个采用IBM POWER7™高性能微处理器实现的SOI DRAM宏[5],并介绍了对微感放大器(µSA)架构的增强[6]。采用该高性能DRAM宏在片上构建32MB的大型L3缓存,从片外接口上消除延迟、面积和功耗,同时提高系统性能,降低成本、功耗和软错误脆弱性。图19.1.1a显示了45nm SOI DRAM器件和深沟(DT)电容器的SEM[7]。DT提供比平面结构多25倍的电容,还用于降低片上电压岛电源噪声。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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