In-Situ Synthesis of Graphene-Like Carbon Encapsulated Copper Particles for Reinforcing Copper Matrix Composites

Shengcheng Shu, Q. Yuan, W. Dai, Mingliang Wu, Dan Dai, Ke Yang, Bo Wang, Cheng‐Te Lin, Thomas Wuebben, J. Degenhardt, C. Regula, R. Wilken, N. Jiang, Joerg Ihde
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引用次数: 9

Abstract

Abstract Owing to the unfavorable wetting and density difference between graphene and copper, it remains challenging to achieve homogeneous dispersion of graphene for utilizing the unique nature of graphene in copper matrix composites. Here, we design an in-situ process to fabricate graphene-like carbon (GLC) reinforcing copper matrix composites: GLC can be directly fabricated on commercial copper particles using modified PECVD method followed by vacuum hot pressing, which is high-efficiency and can be massively produced for graphene reinforced metal matrix composites in industrial level. After hot pressing, the GLC with ultralow content (170 to 350 ppm) can be uniformly dispersed and tightly embedded within the copper matrix. A remarkable thermal conductivity enhancement efficiency of 85% and enhanced thermal conductivity (439 W m−1 K−1), accompanied by the higher wear resistance, can be obtained in our GLC reinforced copper matrix composites. In actual arc ablation performance measurement, the breakdown strength and relative arc ablation resistance of GLC/Cu composites can be significantly improved by 106.5% and 33.3% than pure copper, respectively, demonstrating GLC/Cu composites a promising candidate for application as high voltage electrical contacts.
原位合成类石墨烯碳包覆铜颗粒增强铜基复合材料
由于石墨烯和铜之间的湿润性和密度差异,利用石墨烯在铜基复合材料中的独特性质,实现石墨烯的均匀分散仍然是一个挑战。本研究设计了一种原位制备类石墨烯碳(GLC)增强铜基复合材料的工艺:采用改进的PECVD方法直接在商用铜颗粒上制备类石墨烯碳(GLC),然后进行真空热压,该工艺效率高,可批量生产工业级石墨烯增强金属基复合材料。热压后,超低含量(170 ~ 350 ppm)的GLC可均匀分散,并紧密嵌入铜基体中。GLC增强铜基复合材料的导热系数提高了85%,导热系数提高了439 W m−1 K−1,并具有较高的耐磨性。在实际电弧烧蚀性能测试中,与纯铜相比,GLC/Cu复合材料的击穿强度和相对抗电弧烧蚀性能分别提高了106.5%和33.3%,表明GLC/Cu复合材料在高压电触点领域具有广阔的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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