Silicon-rim-reinforced silicon nitride microscanner with vertical comb actuator and wafer-level vacuum packaging

Abstract

This research proposes a silicon rim for an optically flat mirror and a vertical comb actuator in a silicon nitride (SiN) microscanner. A wafer-level vacuum packaging was also successfully implemented for large angular deflections with low driving voltage. Radius of curvature (ROC) of a SiN mirror of 1 μm-thickness and 1 mm-diameter was measured to be 0.357 m. Optical experiment showed optical tilt angle of 22° at driving voltage of 53 Vrms and resonant frequency of 14.8 kHz, respectively.