Boron phosphorus and arsenic diffusion in MOS transistors: Simulation and analysis in 2D and 3D

N. Guenifi, R. Mahamdi, I. Rahmani
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引用次数: 1

Abstract

GRAPHICAL ABSTRACT ABSTRACT The article introduces the benefits and application features of Silvaco Technology Computer Aided Design ‘TCAD’ tool to predict the performance of electrical components and their reliability. In this work, in order to improve the electrical parameters of MOS transistor such as, threshold voltage and flat band voltage, we have simulated Phosphorus and Arsenic diffusion profiles in three dimensions before and after thermal annealing in a highly doped polysilicon film using the simulator Silvaco TCAD based on Pearson type IV models. The model takes into account the distribution of vacancy mechanisms and effects related to high concentrations, such as the formation of clusters to study solid solubility limit. The results have been analyzed and discussed in order to extract depth of doping (Phosphorus and Arsenic) and they have been able to optimize the silicon oxide thickness, to reduce the penetration of doping. Based on earlier studies a study of the effect of solubility on these profiles was performed.
硼磷和砷在MOS晶体管中的扩散:二维和三维的模拟和分析
摘要本文介绍了Silvaco Technology计算机辅助设计(TCAD)工具在电气元件性能和可靠性预测方面的优势和应用特点。在这项工作中,为了提高MOS晶体管的电学参数,如阈值电压和平带电压,我们使用基于Pearson IV型模型的模拟器Silvaco TCAD在高掺杂多晶硅薄膜中模拟了热退火前后的磷和砷的三维扩散曲线。该模型考虑了空位分布机制和与高浓度相关的影响,如簇的形成,以研究固体溶解度极限。对结果进行了分析和讨论,以便提取掺杂(磷和砷)的深度,并能够优化氧化硅的厚度,以减少掺杂的渗透。在早期研究的基础上,对溶解度对这些剖面的影响进行了研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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