A bi-directional Address-Event transceiver block for low-latency inter-chip communication in neuromorphic systems

Ning Qiao, G. Indiveri
{"title":"A bi-directional Address-Event transceiver block for low-latency inter-chip communication in neuromorphic systems","authors":"Ning Qiao, G. Indiveri","doi":"10.1109/ISCAS.2018.8351623","DOIUrl":null,"url":null,"abstract":"Neuromorphic systems typically use the Address-Event Representation (AER) to transmit signals among nodes, cores, and chips. Communication of Address-Events (AEs) between neuromorphic cores/chips typically requires two parallel digital signal buses for Input/Output (I/O) operations. This requirement can become very expensive for large-scale systems in terms of both dedicated I/O pins and power consumption. In this paper we present a compact fully asynchronous event-driven transmitter/receiver block that is both power efficient and I/O efficient. This block implements high-throughput low-latency bi-directional communication through a parallel AER bus. We show that by placing the proposed AE transceiver block in two separate chips and linking them by a single AER bus, we can drive the communication and switch the transmission direction of the shared bus on a single event basis, from either side with low-latency. We present experimental results that validate the circuits proposed and demonstrate reliable bi-directional event transmission with high-throughput. The proposed AE block, integrated in a neuromorphic chip fabricated using a 28 nm FDSOI process, occupies a silicon die area of 140 μm × 70 μm. The experimental measurements show that the event-driven AE block combined with standard digital I/Os has a direction switch latency of 5 ns and can achieve a worst-case bi-directional event transmission throughput of 28.6M Events/second while consuming 11 pJ per event (26-bit) delivery.","PeriodicalId":6569,"journal":{"name":"2018 IEEE International Symposium on Circuits and Systems (ISCAS)","volume":"73 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on Circuits and Systems (ISCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISCAS.2018.8351623","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Neuromorphic systems typically use the Address-Event Representation (AER) to transmit signals among nodes, cores, and chips. Communication of Address-Events (AEs) between neuromorphic cores/chips typically requires two parallel digital signal buses for Input/Output (I/O) operations. This requirement can become very expensive for large-scale systems in terms of both dedicated I/O pins and power consumption. In this paper we present a compact fully asynchronous event-driven transmitter/receiver block that is both power efficient and I/O efficient. This block implements high-throughput low-latency bi-directional communication through a parallel AER bus. We show that by placing the proposed AE transceiver block in two separate chips and linking them by a single AER bus, we can drive the communication and switch the transmission direction of the shared bus on a single event basis, from either side with low-latency. We present experimental results that validate the circuits proposed and demonstrate reliable bi-directional event transmission with high-throughput. The proposed AE block, integrated in a neuromorphic chip fabricated using a 28 nm FDSOI process, occupies a silicon die area of 140 μm × 70 μm. The experimental measurements show that the event-driven AE block combined with standard digital I/Os has a direction switch latency of 5 ns and can achieve a worst-case bi-directional event transmission throughput of 28.6M Events/second while consuming 11 pJ per event (26-bit) delivery.
用于神经形态系统中低延迟芯片间通信的双向地址-事件收发器块
神经形态系统通常使用地址-事件表示(AER)在节点、核心和芯片之间传输信号。神经形态内核/芯片之间的地址事件(AEs)通信通常需要两个并行的数字信号总线进行输入/输出(I/O)操作。在专用I/O引脚和功耗方面,这种要求对于大型系统来说可能会变得非常昂贵。在本文中,我们提出了一个紧凑的完全异步事件驱动的发送/接收块,它既节能又高效I/O。该模块通过并行AER总线实现高吞吐量、低延迟的双向通信。我们表明,通过将所提出的AE收发器块放置在两个独立的芯片中,并通过单个AER总线连接它们,我们可以在单个事件的基础上驱动通信并从任意一侧以低延迟切换共享总线的传输方向。我们的实验结果验证了所提出的电路,并证明了高吞吐量的可靠双向事件传输。所提出的声发射模块集成在采用28 nm FDSOI工艺制造的神经形态芯片中,占据140 μm × 70 μm的硅模面积。实验测量表明,事件驱动的AE块与标准数字I/ o相结合,具有5 ns的方向切换延迟,在最坏情况下可以实现28.6M Events/s的双向事件传输吞吐量,而每个事件(26位)传输消耗11 pJ。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信