An integrated folded-patch antenna for wireless microsystems

P. Mendes, A. Polyakov, M. Bartek, J. Burghartz, J. Correia
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引用次数: 10

Abstract

A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.
用于无线微系统的集成折叠贴片天线
实现了一种工作频率为5.62 GHz并应用于无线传感器网络的全集成折叠贴片天线。整体尺寸为4/spl倍/4/spl倍/1 mm/sup 3/,测量带宽为100 MHz,效率为32%。天线的制造基于晶圆级封装技术,由两个具有穿过基板的电通孔和3D金属化的粘合玻璃基板组成。天线样机的实测电特性与仿真结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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