An 80×60 range image sensor based on 10µm 50MHz lock-in pixels in 0.18µm CMOS

D. Stoppa, N. Massari, L. Pancheri, M. Malfatti, M. Perenzoni, L. Gonzo
{"title":"An 80×60 range image sensor based on 10µm 50MHz lock-in pixels in 0.18µm CMOS","authors":"D. Stoppa, N. Massari, L. Pancheri, M. Malfatti, M. Perenzoni, L. Gonzo","doi":"10.1109/ISSCC.2010.5433980","DOIUrl":null,"url":null,"abstract":"Because we are living in a three-dimensional world, the usual intensity map provided by standard digital cameras is often not sufficient to build the sophisticated models required by systems capable of analyzing and interpreting their environment. A three-dimensional (3D) image sensor has great potential for improvement in many areas like ambient-assisted living, virtual reality, gaming, security and surveillance, etc., because it significantly increases the robustness of object classification and avoids time-consuming post-processing steps. Although the first commercial products are now available on the market, one of the main barriers to mass deployment of such 3D vision tools is the large pixel dimension, which ultimately reduces the sensor resolution and increases costs.","PeriodicalId":6418,"journal":{"name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","volume":"78 1","pages":"406-407"},"PeriodicalIF":0.0000,"publicationDate":"2010-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2010.5433980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 29

Abstract

Because we are living in a three-dimensional world, the usual intensity map provided by standard digital cameras is often not sufficient to build the sophisticated models required by systems capable of analyzing and interpreting their environment. A three-dimensional (3D) image sensor has great potential for improvement in many areas like ambient-assisted living, virtual reality, gaming, security and surveillance, etc., because it significantly increases the robustness of object classification and avoids time-consuming post-processing steps. Although the first commercial products are now available on the market, one of the main barriers to mass deployment of such 3D vision tools is the large pixel dimension, which ultimately reduces the sensor resolution and increases costs.
基于0.18µm CMOS中的10µm 50MHz锁定像素的80×60距离图像传感器
因为我们生活在一个三维世界中,标准数码相机提供的通常的强度图往往不足以建立分析和解释其环境的系统所需的复杂模型。三维(3D)图像传感器在环境辅助生活、虚拟现实、游戏、安全和监控等许多领域具有巨大的改进潜力,因为它显著提高了目标分类的鲁棒性,避免了耗时的后处理步骤。虽然第一批商业产品现已上市,但大规模部署此类3D视觉工具的主要障碍之一是大像素尺寸,这最终降低了传感器分辨率并增加了成本。
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