Enhancement of Partial Discharge Resistance and Breakdown Strength Characteristics of Low-Density Polyethylene Nanocomposites Using Plasma Treatment Method

Q2 Engineering
R. F. Kurnia, Norhafezaidi Mat Saman, Noor 'Aliaa Awang, Mohd Hafizi Ahmad, Z. Buntat, Z. Adzis
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引用次数: 0

Abstract

: Insulations in the power cable system are prone to ageing and degradation, eventually leading to a complete breakdown. One of the solutions to reduce insulation breakdown in polymeric insulation is by adding nanofillers into the polymer matrices of the insulation to form polymer nanocomposites. However, the addition of the nanofiller into the polymer usually results in agglomeration inside the nanocomposites. Recently, atmospheric pressure plasma (APP) has been introduced by adopting the nanofiller's surface modification method to hinder agglomeration formation. The aims of using APP are to enhance the nanofiller-polymer interfaces and improve the dielectric properties, emphasizing partial discharge (PD) resistance and AC breakdown strength. In this study, APP has been used to treat boron nitride (BN) and silicon dioxide (SiO 2 ) nanoparticle surfaces for the purpose of enhancing the compatibility with low-density polyethylene (LDPE) matrices. Untreated and plasma-treated nanoparticles have been added into LDPE with different filler loading of 1 wt%, 3 wt% and 5 wt% via the direct compounding method. Compared with untreated nanocomposites, the 30-minutes plasma-treated nanocomposites could improve the PD resistance by reducing the PD magnitude up to 513 pC and reducing the PD number to 11661. Moreover, the AC breakdown strength of the plasma-treated nanocomposites had increased from 0.53 kV/mm to 26.65 kV/mm. If compared to LDPE/BN nanocomposites, it was discovered that the LDPE/SiO 2 nanocomposites displayed significantly better dielectric characteristics. In addition, plasma treatment of the nanoparticles could produce nanocomposites with better formulation stability and promising dielectric performance, which can prolong the insulation's lifetime and ensure the reliability of the power supply.
等离子体处理增强低密度聚乙烯纳米复合材料的局部放电电阻和击穿强度特性
电力电缆系统中的绝缘容易老化和退化,最终导致完全故障。减少聚合物绝缘击穿的解决方案之一是在绝缘的聚合物基体中加入纳米填料,形成聚合物纳米复合材料。然而,在聚合物中加入纳米填料通常会导致纳米复合材料内部的团聚。近年来,大气压等离子体(APP)被引入,采用纳米填料的表面改性方法来阻止团聚的形成。应用APP的目的是增强纳米填料-聚合物界面和改善介电性能,重点是耐局部放电(PD)和交流击穿强度。在本研究中,应用APP对氮化硼(BN)和二氧化硅(sio2)纳米颗粒表面进行处理,以增强其与低密度聚乙烯(LDPE)基质的相容性。将未经处理和等离子体处理的纳米颗粒分别以1 wt%、3 wt%和5 wt%的填料填充到LDPE中,采用直接复合的方法。与未处理的纳米复合材料相比,经过30分钟等离子体处理的纳米复合材料可以将PD量级降低到513 pC,将PD数降低到11661,从而提高其抗PD能力。此外,等离子体处理的纳米复合材料的交流击穿强度从0.53 kV/mm提高到26.65 kV/mm。与LDPE/BN纳米复合材料相比,发现LDPE/ sio2纳米复合材料具有明显更好的介电特性。此外,等离子体处理制备的纳米复合材料具有更好的配方稳定性和良好的介电性能,可以延长绝缘寿命,保证电源的可靠性。
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来源期刊
CiteScore
2.70
自引率
0.00%
发文量
31
审稿时长
20 weeks
期刊介绍: International Journal on Electrical Engineering and Informatics is a peer reviewed journal in the field of electrical engineering and informatics. The journal is published quarterly by The School of Electrical Engineering and Informatics, Institut Teknologi Bandung, Indonesia. All papers will be blind reviewed. Accepted papers will be available on line (free access) and printed version. No publication fee. The journal publishes original papers in the field of electrical engineering and informatics which covers, but not limited to, the following scope : Power Engineering Electric Power Generation, Transmission and Distribution, Power Electronics, Power Quality, Power Economic, FACTS, Renewable Energy, Electric Traction, Electromagnetic Compatibility, Electrical Engineering Materials, High Voltage Insulation Technologies, High Voltage Apparatuses, Lightning Detection and Protection, Power System Analysis, SCADA, Electrical Measurements Telecommunication Engineering Antenna and Wave Propagation, Modulation and Signal Processing for Telecommunication, Wireless and Mobile Communications, Information Theory and Coding, Communication Electronics and Microwave, Radar Imaging, Distributed Platform, Communication Network and Systems, Telematics Services, Security Network, and Radio Communication. Computer Engineering Computer Architecture, Parallel and Distributed Computer, Pervasive Computing, Computer Network, Embedded System, Human—Computer Interaction, Virtual/Augmented Reality, Computer Security, VLSI Design-Network Traffic Modeling, Performance Modeling, Dependable Computing, High Performance Computing, Computer Security.
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