A stainless-steel-based capacitive pressure sensor chip and its microwelding integration

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI:10.1109/TRANSDUCERS.2015.7181114

Xing Chen, Daniel S. Brox, B. Assadsangabi, M. S. Mohamed Ali, K. Takahata

{"title":"A stainless-steel-based capacitive pressure sensor chip and its microwelding integration","authors":"Xing Chen, Daniel S. Brox, B. Assadsangabi, M. S. Mohamed Ali, K. Takahata","doi":"10.1109/TRANSDUCERS.2015.7181114","DOIUrl":null,"url":null,"abstract":"A stainless-steel (SS) chip of capacitive pressure sensor and its new integration method are developed. The sensors are microfabricated through thermal bonding of the chip dies made of medical-grade SS to the Au-polyimide diaphragm film. The capacitive cavity design with dead-end holes is verified to increase the pressure sensitivity. Laser microwelding is applied to permanently bond the sensor chips onto SS substrates. The microwelding is revealed to provide twice the mechanical strength and ~6× electrical conductance in its bond compared with a conductive epoxy case. The microwelded sensor exhibits an average sensitivity of 120 ppm/mmHg close to its pre-welding level. The welding integration with a SS antenna stent is demonstrated. The results suggest that laser microwelding is a promising packaging technique for SS-based biomedical and implant microdevices that require long-term bond reliability.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2015.7181114","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

Abstract

A stainless-steel (SS) chip of capacitive pressure sensor and its new integration method are developed. The sensors are microfabricated through thermal bonding of the chip dies made of medical-grade SS to the Au-polyimide diaphragm film. The capacitive cavity design with dead-end holes is verified to increase the pressure sensitivity. Laser microwelding is applied to permanently bond the sensor chips onto SS substrates. The microwelding is revealed to provide twice the mechanical strength and ~6× electrical conductance in its bond compared with a conductive epoxy case. The microwelded sensor exhibits an average sensitivity of 120 ppm/mmHg close to its pre-welding level. The welding integration with a SS antenna stent is demonstrated. The results suggest that laser microwelding is a promising packaging technique for SS-based biomedical and implant microdevices that require long-term bond reliability.

查看原文本刊更多论文

一种不锈钢电容式压力传感器芯片及其微焊接集成技术

研制了一种电容式压力传感器的不锈钢芯片及其集成方法。传感器是通过将医用级SS制成的芯片模具与金聚酰亚胺膜片热粘合而制成的。验证了带端面孔的电容腔设计可以提高压力灵敏度。采用激光微焊接技术将传感器芯片永久粘接在SS基板上。与导电环氧树脂外壳相比，微焊接的机械强度提高了两倍，电导率提高了6倍。微焊接传感器的平均灵敏度为120 ppm/mmHg，接近其焊前水平。演示了与SS天线支架的焊接集成。结果表明，激光微焊接是一种很有前途的封装技术，用于基于ss的生物医学和植入微设备，需要长期的键合可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

自引率

0.00%

发文量