Design, fabrication and measurement of TSV interposer integrated X-band microstrip filter

Yunheng Sun, Yufeng Jin, Han Cai, Shengli Ma, Liu-lin Hu, Shuwei He
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引用次数: 1

Abstract

In this paper, we present a TSV interposer integrated X-band microstrip filter. It designed as working at X band with an insertion loss (IL) of 2.2dB, measuring 2.8mm×3.7mm in size. With processed sample, the measured bandwidth (BW) is about 2.33GHz, the passband insertion loss is about 2.2dB.
TSV插片集成x波段微带滤波器的设计、制造与测量
在本文中,我们提出了一种TSV中间体集成x波段微带滤波器。它设计为工作在X波段,插入损耗(IL)为2.2dB,尺寸为2.8mm×3.7mm。经过处理的样品,测量带宽(BW)约为2.33GHz,通带插入损耗约为2.2dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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