An investigation of interply slip behaviour in AS4/PEEK at forming temperatures

Abstract

A test procedure was developed to evaluate the behaviour of the deformation mechanism known as interply slip at temperatures representative of solid-phase and melt-phase forming. The interfaces resulting from plies oriented parallel to the deformation direction and from plies of differing orientation are examined. Results of these tests are presented and observations are noted. The primary influences were found to be temperature and interfacial shear rate. Power-law approximations are determined for the rate variations, and the correlation of these power-law parameters with temperature is discussed.