Simulation of Impact Rupture in Polysilicon Mems

A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini
{"title":"Simulation of Impact Rupture in Polysilicon Mems","authors":"A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini","doi":"10.1109/ESIME.2006.1643984","DOIUrl":null,"url":null,"abstract":"The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"26 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643984","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach
多晶硅Mems冲击破裂模拟
本文采用Voronoi镶嵌法和有限元网格法建立了多晶硅微机电系统的二维几何模型,研究了多晶硅微机电系统的冲击破裂问题。采用黏聚牵引-跳跃软化规律模拟了沿晶和穿晶破裂过程;采用简化的三层次多尺度方法对意外跌落进行了模拟
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
145
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信