Microfluidics 5: PDMS Microchannel Bonding on Glass/PDMS v2

Serhat Sevli
{"title":"Microfluidics 5: PDMS Microchannel Bonding on Glass/PDMS v2","authors":"Serhat Sevli","doi":"10.17504/protocols.io.bxkhpkt6","DOIUrl":null,"url":null,"abstract":"Microfluidic chips, made of PDMS, are one-side open when fabricated. Another layer of glass, PDMS, or etc is needed. Liquid seal is provided by complete covalent bonding between layers or by external forces like threads, magnets or similar factors. This protocol describes the covalent bonding of PDMS on glass by air plasma technique.","PeriodicalId":20882,"journal":{"name":"protocols.io","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"protocols.io","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.17504/protocols.io.bxkhpkt6","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Microfluidic chips, made of PDMS, are one-side open when fabricated. Another layer of glass, PDMS, or etc is needed. Liquid seal is provided by complete covalent bonding between layers or by external forces like threads, magnets or similar factors. This protocol describes the covalent bonding of PDMS on glass by air plasma technique.
微流体学5:玻璃上PDMS微通道键合/PDMS v2
由PDMS制成的微流控芯片在制造时是单面开放的。需要另一层玻璃,PDMS或其他。液体密封由各层之间的完全共价键或螺纹、磁铁或类似因素等外力提供。本文描述了用空气等离子体技术在玻璃上形成PDMS共价键的过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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