Effective Dielectric Passivation Scheme in Area-Selective Front/Back Poly-Si/SiOx Passivating Contact Solar Cells

Kejun Chen, W. Nemeth, San Theingi, M. Page, P. Stradins, S. Agarwal, D. Young
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Abstract

Despite the high efficiencies reached by heavily doped poly-Si/SiOx passivating contact solar cells, challenges like the high front parasitic absorption still limit their performance. Previously, we showed a wet etching technique using self-aligned metal grids to remove the front poly-Si in the non-metallized region. Here, we focus on the effective dielectric passivation on this tunneling oxide/n+ in-diffused region. The effect of poly-Si thickness was studied to balance between the passivation quality and the current gain. We then compared various dielectric passivation schemes using SiNx, Al2O3, and stacks thereof via injection-level dependent lifetime and the transfer length method. We demonstrate a SiNx/Al2O3 stack yielded the best passivation performance within device process limitation and obtained an improved front/back poly-Si/SiOx passivating contact device, with a short circuit current density of 41.8 mA/cm2 and an efficiency of 21.8%.
区域选择性前/后多晶硅/氧化硅钝化接触式太阳能电池的有效介电钝化方案
尽管大量掺杂的多晶硅/SiOx钝化接触太阳能电池达到了高效率,但诸如高前沿寄生吸收等挑战仍然限制了它们的性能。之前,我们展示了一种湿蚀刻技术,使用自对准的金属网格去除非金属化区域的前多晶硅。本文重点研究了氧化物/n+在隧道扩散区的有效介电钝化作用。为了在钝化质量和电流增益之间取得平衡,研究了多晶硅厚度的影响。然后,我们通过注入水平相关寿命和传递长度方法,比较了使用SiNx、Al2O3及其堆叠的各种介电钝化方案。我们证明了在器件工艺限制下,SiNx/Al2O3堆叠产生了最佳的钝化性能,并获得了改进的前/后多晶硅/SiOx钝化触点器件,短路电流密度为41.8 mA/cm2,效率为21.8%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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