Electron Beam Induced Damage

C. Kisielowski, R. Erni, Jannik C. Meyer
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引用次数: 1

Abstract

A next generation electron microscopes is currently being developed by the Department of Energy as a collaborative effort to redesign the instruments around aberration corrected optics [1]. Within this project, the TEAM 0.5 prototype microscope is currently being commissioned. The instrument is equipped with a high brightness gun and a monochromator [2]. However, already in the past concerns were raised [3] and debated [4] that the high current density in field emission microscopes may alter the atomic structure of materials too fast to record undamaged images of compound semiconductors. Concerns about electron beam induced knock-on damage are indeed very relevant because the TEAM project aims at reconstructing the three dimensional structure of materials at atomic resolution, which requires maintaining structural integrity. On the other hand detailed knowledge about knock-on and ionisation damage in such microscopes is absent and the TEAM0.5 microscope is ideally suited for such investigations since its unprecedented performance allows for the detection of single atoms of most elements of the periodic system [2].
电子束致损伤
新一代电子显微镜目前正在由能源部开发,作为围绕像差校正光学[1]重新设计仪器的合作努力。在这个项目中,TEAM 0.5原型显微镜目前正在调试中。仪器配有高亮度枪和单色仪[2]。然而,过去已经有人提出和争论场发射显微镜中的高电流密度可能会太快地改变材料的原子结构,从而无法记录化合物半导体的无损图像。对电子束引起的撞击损伤的担忧确实是非常相关的,因为TEAM项目旨在以原子分辨率重建材料的三维结构,这需要保持结构的完整性。另一方面,在这种显微镜中关于撞击和电离损伤的详细知识是缺失的,TEAM0.5显微镜非常适合这种研究,因为它前所未有的性能允许检测周期系统[2]中大多数元素的单个原子。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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