Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer

M. Bertrand, Em Pistone, G. Acri, D. Kaddour, F. Podevin, V. Puyal, S. Wipf, C. Wipf, M. Wietstruck, M. Kaynak, P. Ferrari
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引用次数: 18

Abstract

This paper presents D-band mm-wave SIWs, which are embedded in a high-resistivity silicon interposer. Thanks to the interposer thickness equal to $\pmb{70\ \mu} \mathbf{m}$, high-performance SIW were obtained, with measured attenuation constant between 0.4 and 0.6 dB/mm from 110 GHz to 170 GHz. These first results pave the way for the realization of high performance passive circuits and antennas embedded in the interposer. Also, by using a fully shielded waveguide highly insensitive to adj acent wave-guiding and radiating structures, this topology provides significant advantages for packaging solutions at mm-wave frequencies. Such a functionalized interposer could offer lower cost, higher electrical performance as compared to standard CMOS technologies.
毫米波功能化硅中间层的衬底集成波导
本文介绍了一种嵌入在高电阻率硅中间体中的d波段毫米波SIWs。由于中间体厚度为$\pmb{70\ \mu} \mathbf{m}$,因此获得了高性能的SIW,在110 GHz至170 GHz范围内测量到的衰减常数在0.4 ~ 0.6 dB/mm之间。这些初步结果为实现嵌入在中间插孔中的高性能无源电路和天线铺平了道路。此外,通过使用对中介波导和辐射结构高度不敏感的全屏蔽波导,该拓扑结构为毫米波频率的封装解决方案提供了显着优势。与标准CMOS技术相比,这种功能化中间体可以提供更低的成本和更高的电气性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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