Adsorption isotherms of halogen compounds of acetic acid and alkaloids on a copper(100) plane during electrodeposition of copper from acid copper sulphate baths

Abstract

The effect of halogen compounds of acetic acid, strychnin and quinin sulphates on the deposition of copper on a copper(100) plane was studied. The exchange current densities (i₀) were evaluated using Tafel relations with and without addition agents. The concentration of addition agent had a significant influence on the i₀ value. Surface coverages determined from the i₀ values were consistent and fitted the Langmuir adsorption isotherm. The free energies of adsorption of chloro and bromo acetic acids are negative, indicating the strong adsorption and inhibition of the deposition process by these addition agents.