Vibration analysis and parameter optimization of seedling pushing device of transplanting mechanism with planetary elliptic gears

IF 1 4区工程技术 Q3 ENGINEERING, MULTIDISCIPLINARY

Journal of the Chinese Institute of Engineers Pub Date : 2023-01-20 DOI:10.1080/02533839.2022.2161945

Dequan Zhu, Kejie Gao, K. Xue, Shun Zhang, J. Liao, Ting Wang, Ruize Hou, Fuming Kuang

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引用次数: 0

Abstract

ABSTRACT The vibration induced by the seedling pushing device in the transplanting mechanism gravely undermines the transplanting performance. In this study, the structure and working process of the transplanting mechanism were analyzed. Then, an orthogonal test design for optimizing the vibration performance of the transplanting mechanism was applied to determine the optimum operating speed, counterweight mass, and spring stiffness. The parameter optimization results were finally verified by planting quality simulation and bench test. The result shows that when the operating speed was 250.0 r/min, the counterweight mass was 0.9 kg, and the spring stiffness was 140.0 N/m, the mechanism’s working performance and planting effect were the best. According to the analysis of data collected by the sensor, the maximum stress value was 6.05 MPa (reduced by 18.8%), the perpendicularity was 93.58% (increased by 6.0%), and the coefficient of speed fluctuation was 3.16 (diminished by 28.7%), which effectively reduces the force of the transplanting mechanism on the seedlings and improves the quality of operation.

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行星椭圆齿轮移栽机构推苗装置振动分析及参数优化

摘要移栽机构中推苗装置引起的振动严重影响移栽性能。本研究对移栽机构的结构和工作过程进行了分析。采用正交试验设计优化移栽机构的振动性能，确定移栽机构的最佳运行速度、配重质量和弹簧刚度。最后通过种植质量模拟和台架试验验证了参数优化结果。结果表明，当工作转速为250.0 r/min，配重质量为0.9 kg，弹簧刚度为140.0 N/m时，该机构的工作性能和种植效果最好。通过对传感器采集数据的分析，最大应力值为6.05 MPa(降低18.8%)，垂直度为93.58%(提高6.0%)，速度波动系数为3.16(降低28.7%)，有效降低了移栽机构对秧苗的作用力，提高了操作质量。

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来源期刊

Journal of the Chinese Institute of Engineers 工程技术-工程：综合

CiteScore

2.30

自引率

9.10%

发文量

审稿时长

6.8 months

期刊介绍： Encompassing a wide range of engineering disciplines and industrial applications, JCIE includes the following topics: 1.Chemical engineering 2.Civil engineering 3.Computer engineering 4.Electrical engineering 5.Electronics 6.Mechanical engineering and fields related to the above.