{"title":"Analysis on Thermal Contact Resistance of the Connecting Structure in Enclosed Rugged Computer","authors":"Ma Guo-jun, MU Cui-cui, Gu Xiao-le, Wu Cheng-wei","doi":"10.12068/J.ISSN.1005-3026.2020.12.012","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":16435,"journal":{"name":"Journal of Northeastern University","volume":"41 1","pages":"1747"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Northeastern University","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.12068/J.ISSN.1005-3026.2020.12.012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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