Dependence of Resistivity on Thickness of Vacuum Deposited Copper Thin Films

Abstract

In depth understanding of resistivity of metals is of utmost importance for optimizing circuit designs and electrical systems. In this study, we investigated the relation between film thickness (in the range of 25−350 nm) and film resistivity of Cu thin films, with respect to thin film temperature sensors. The films were deposited in a vacuum deposition chamber over pyrex substrates and the film resistances were measured using 4 point probe technique. The empirical relationship established by Lacy has been used along with our experimental results in order to calculate the constants relating the filmsubstrate compatibility, which influences the change of resistivity with thickness.