Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245143

Jibing Chen, Yuandan Xie, Zhanwen He, Nong Wan, Yiping Wu

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引用次数: 3

Abstract

To verify whether the results of rapid thermal fatigue of solder joint are consistent with that of the conventional fatigue method, the repeated thermal cycling condition of alternating temperature should be created. In this paper, an experiment, which heat rapidly a metal boss under the single solder joint in 10 seconds by the induced eddy current effect of electromagnetic field and then stop to heat it at the same time in sequence, was implemented. That is to say, the single solder joint above the boss was heated and cooled through heat conduction of the boss where the heat quantity is generated by the electromagnetic induction heating. The condition of rapid thermal cycle was realized by this method. When the single solder joint was subjected to rapid thermal cycling, the interfacial microstructure between the solder ball and Cu substrate was observed and analyzed by SEM. The results indicated that this method supplying rapid heat source by induction heating is feasible to investigate the rapid thermal fatigue behavior of single solder joint. This method can provide more experience for fatigue failure to effectively improve the reliability of the electronic packaging devices.

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单根SnAgCu焊点热疲劳性能分析

为了验证焊点快速热疲劳的结果与常规疲劳法的结果是否一致，需要创建交替温度的反复热循环条件。本文进行了利用电磁场的感应涡流效应在10秒内对单个焊点下的金属凸台进行快速加热，然后同时停止依次加热的实验。也就是说，焊台上方的单个焊点通过焊台的热传导进行加热和冷却，其中的热量是通过电磁感应加热产生的。该方法实现了快速热循环的条件。采用扫描电镜对单焊点快速热循环过程中钎料球与Cu衬底界面的微观结构进行了观察和分析。结果表明，采用感应加热提供快速热源的方法研究单个焊点的快速热疲劳行为是可行的。该方法可为疲劳失效提供更多经验，有效提高电子封装器件的可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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