G. Xie, E. Xu, Junmin Lee, N. Hashemi, F. Y. Fu, Bo Zhang, W. Ng
{"title":"Breakdown voltage enhancement for power AlGaN/GaN HEMTs with Air-bridge Field Plate","authors":"G. Xie, E. Xu, Junmin Lee, N. Hashemi, F. Y. Fu, Bo Zhang, W. Ng","doi":"10.1109/ISPSD.2012.6229090","DOIUrl":null,"url":null,"abstract":"This paper presents a breakdown voltage enhancement technique for power AlGaN/GaN HEMTs by using novel Air-bridge Field Plate (AFP). The device features a metal field plate that jumps from the source over the gate region and lands between gate and drain. Simulation results show that the HEMTs with Air-bridge Field Plate can provide a new degree of freedom to modulate the device surface electric field. In a device with gate to drain distance of 6 µm, gate length of 0.8 µm, two times higher forward blocking voltage of 450 V was obtained at VGS = −5 V when compared to a device with an optimized conventional field plate device (240 V) for a given process.","PeriodicalId":6363,"journal":{"name":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","volume":"1 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2012.6229090","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This paper presents a breakdown voltage enhancement technique for power AlGaN/GaN HEMTs by using novel Air-bridge Field Plate (AFP). The device features a metal field plate that jumps from the source over the gate region and lands between gate and drain. Simulation results show that the HEMTs with Air-bridge Field Plate can provide a new degree of freedom to modulate the device surface electric field. In a device with gate to drain distance of 6 µm, gate length of 0.8 µm, two times higher forward blocking voltage of 450 V was obtained at VGS = −5 V when compared to a device with an optimized conventional field plate device (240 V) for a given process.