{"title":"Deformed Microstructure Characteristics and Nano-Mechanical Properties of CuSn10P1 Alloy","authors":"Quiping Wang, R. Zhou, Yongkun Li, Chunjian Wang","doi":"10.2139/ssrn.3680271","DOIUrl":null,"url":null,"abstract":"Enclosed cooling slope channel was adopted to prepare CuSn10P1 semi-solid sample. Compared with as-cast sample by conventional liquid forming, the brittle phases among intergranular microstructure reduced, which prevented the risk of thermal cracks. During hot deformation process, the formation and movement of dislocations results in slipping bands. The β' -Cu13.7Sn phase balanced the Young's modulus in the microstructure and improved the ability of coordinated deformation among grains. These findings provide a theoretical guidance for semi-solid CuSn10P1 deformation process.","PeriodicalId":18731,"journal":{"name":"Materials Processing & Manufacturing eJournal","volume":"28 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Processing & Manufacturing eJournal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2139/ssrn.3680271","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Enclosed cooling slope channel was adopted to prepare CuSn10P1 semi-solid sample. Compared with as-cast sample by conventional liquid forming, the brittle phases among intergranular microstructure reduced, which prevented the risk of thermal cracks. During hot deformation process, the formation and movement of dislocations results in slipping bands. The β' -Cu13.7Sn phase balanced the Young's modulus in the microstructure and improved the ability of coordinated deformation among grains. These findings provide a theoretical guidance for semi-solid CuSn10P1 deformation process.