Versatile CMOS-MEMS integrated piezoelectric platform

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2015-06-21 DOI:10.1109/TRANSDUCERS.2015.7181409

J. M. Tsai, M. Daneman, B. Boser, D. Horsley, M. Rais-Zadeh, H. Tang, Yipeng Lu, O. Rozen, F. Liu, M. Lim, F. Assaderaghi

引用次数: 34

Abstract

We present the extension of the InvenSense fabrication platform to piezoelectric transduction. The newly proposed CMOS-MEMS Integrated Piezoelectric Platform inherits the wafer bonding advantages of its predecessor, leverages existing semiconductor infrastructure, and is applicable to a wide range of applications.

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通用CMOS-MEMS集成压电平台

我们将InvenSense制造平台扩展到压电转导。新提出的CMOS-MEMS集成压电平台继承了其前身的晶圆键合优势，利用现有的半导体基础设施，适用于广泛的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

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