MBus: An ultra-low power interconnect bus for next generation nanopower systems

P. Pannuto, Yoonmyung Lee, Ye-Sheng Kuo, Z. Foo, B. Kempke, Gyouho Kim, R. Dreslinski, D. Blaauw, P. Dutta
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引用次数: 16

Abstract

As we show in this paper, I/O has become the limiting factor in scaling down size and power toward the goal of invisible computing. Achieving this goal will require composing optimized and specialized-yet reusable-components with an interconnect that permits tiny, ultra-low power systems. In contrast to today's interconnects which are limited by power-hungry pull-ups or high-overhead chip-select lines, our approach provides a superset of common bus features but at lower power, with fixed area and pin count, using fully synthesizable logic, and with surprisingly low protocol overhead. We present MBus, a new 4-pin, 22.6 pJ/bit/chip chip-to-chip interconnect made of two "shoot-through" rings. MBus facilitates ultra-low power system operation by implementing automatic power-gating of each chip in the system, easing the integration of active, inactive, and activating circuits on a single die. In addition, we introduce a new bus primitive: power oblivious communication, which guarantees message reception regardless of the recipient's power state when a message is sent. This disentangles power management from communication, greatly simplifying the creation of viable, modular, and heterogeneous systems that operate on the order of nanowatts. To evaluate the viability, power, performance, overhead, and scalability of our design, we build both hardware and software implementations of MBus and show its seamless operation across two FPGAs and twelve custom chips from three different semiconductor processes. A three-chip, 2.2 mm3 MBus system draws 8 nW of total system standby power and uses only 22.6 pJ/bit/chip for communication. This is the lowest power for any system bus with MBus 's feature set.
MBus:用于下一代纳米电源系统的超低功耗互连总线
正如我们在本文中所展示的,I/O已经成为缩小大小和实现不可见计算目标的限制因素。要实现这一目标,需要组合优化的、专门的、可重复使用的组件,并通过互连实现微型、超低功耗的系统。与当今受耗电上拉或高开销芯片选择线限制的互连相比,我们的方法提供了通用总线功能的超集,但功耗较低,具有固定的面积和引脚数,使用完全可合成的逻辑,并且具有令人惊讶的低协议开销。我们提出了MBus,一种新的4引脚,22.6 pJ/bit/chip芯片对芯片互连,由两个“穿透”环组成。MBus通过实现系统中每个芯片的自动功率门控,简化了在单个芯片上集成有源、无源和激活电路,从而促进了超低功耗系统的运行。此外,我们还引入了一种新的总线原语:功率无关通信,它保证消息在发送时无论接收方的功率状态如何都能接收到消息。这将电源管理从通信中解放出来,极大地简化了可行的、模块化的、异构的、以毫瓦量级运行的系统的创建。为了评估我们设计的可行性、功耗、性能、开销和可扩展性,我们构建了MBus的硬件和软件实现,并展示了其在两个fpga和来自三种不同半导体工艺的12个定制芯片上的无缝运行。一个三芯片、2.2 mm3 MBus系统的总系统待机功率为8nw,通信功耗仅为22.6 pJ/bit/chip。这是具有MBus特性集的任何系统总线的最低功耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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