The Effect of Interfacial Roughness on Residual Stresses in Electron Beam-Physical Vapor Deposition of Thermal Barrier Coatings

Bochun Zhang, Kuiying Chen, N. Baddour
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引用次数: 2

Abstract

Residual stresses play an essential role in determining the failure mechanisms and life of an electron beam-physical vapour deposition thermal barrier coating (EB-PVD TBC) system. In this paper, a new transitional roughness model was proposed and applied to describe the interfacial roughness profile during thermal cycles. Finite element models were implemented to calculate residual stresses at specific positions close to the interface of TBCs using temperature process-dependent model parameters. Combining stresses evaluated at valleys of the topcoat (TC) and excessive sharp tip roughness profiles, positions where the maximum out-of-plane residual stresses occur were identified and used to explain possible cracking routes of EB-PVD TBCs as interfacial roughness evolves during thermal cycling.
界面粗糙度对电子束物理气相沉积热障涂层残余应力的影响
残余应力在电子束-物理气相沉积热障涂层(EB-PVD TBC)系统的失效机制和寿命中起着至关重要的作用。本文提出了一种新的过渡粗糙度模型,并将其应用于热循环过程中界面粗糙度的描述。采用与温度过程相关的模型参数,建立有限元模型,计算tbc界面附近特定位置的残余应力。结合面漆谷(TC)的应力评估和过于尖锐的尖端粗糙度剖面,确定了最大面外残余应力发生的位置,并用于解释EB-PVD tbc在热循环过程中随着界面粗糙度的变化可能出现的开裂路线。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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