Excellent Mechanical Properties and High Electrical Conductivity of Cu-Co-Si-Ti Alloy Due to Multiple Strengthening

Y. Geng, Yijie Ban, Xu Li, Yi Zhang, K. Song, Yanlin Jia, B. Tian, Meng Zhou, Yong Liu, A. Volinsky
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引用次数: 15

Abstract

High performance copper alloys are widely used in electrical, electronic, aerospace fields welcomed due to their high electrical conductivity and excellent mechanical properties. At present work, we proposed a new class of Cu-Co-Si-Ti alloy by incorporating the multiple alloying elements, resulting in the multiple strengthening during heat treatment. The achievement of solution strengthening, deformation strengthening and dual-nanoprecipitation strengthening leaded to the Cu-Co-Si-Ti alloy with excellent tensile strength (617.9 MPa) and high electrical conductivity (41.7% IACS) by the optimum process of 50% cold rolling and aging at 500 °C for 30 min. EBSD was used to analyze the microstructure and texture evolution during the aging process. Moreover, it was found that the volume fraction of Goss, Brass, copper and S texture had close connections with the mechanical properties. By comparing with the contributions of multiple strengthening mechanisms, dual-nanoprecipitation strengthening contributed quite a lot due to the nanoprecipitation of Co2Si and Cu4Ti.
Cu-Co-Si-Ti复合强化合金的优异力学性能和高导电性
高性能铜合金因其高导电性和优异的力学性能,在电气、电子、航空航天等领域得到了广泛的应用。在目前的工作中,我们提出了一类新的Cu-Co-Si-Ti合金,通过加入多种合金元素,在热处理过程中产生多重强化。采用50%冷轧、500℃时效30 min的最佳工艺,获得了固溶强化、变形强化和双纳米沉淀强化,获得了优异的抗拉强度(617.9 MPa)和高电导率(41.7% IACS)的Cu-Co-Si-Ti合金。此外,还发现Goss、Brass、copper和S织构的体积分数与力学性能密切相关。与多种强化机制的贡献相比,Co2Si和Cu4Ti的纳米沉淀对双纳米沉淀强化的贡献更大。
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