Stress and Failure Analyses of Adhesive-Bonded Composite Joints Using ASTM D3165 Specimens

H. Huang, C. Yang, J. Tomblin, P. Harter
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引用次数: 18

Abstract

An analytical model was developed to determine the stress and strain distributions of single-lap adhesive-bonded composite joints under tension. Both the adherend and the adhesive were assumed linear elastic in the derivations. The Laminated Plate Theory was used in defining the mechanical behavior of the composite adherends, whereas the linear elasticity theory was applied to describe the material response of the adhesive. By doing so, the stresses in the adhesive can vary through the bondline thickness. After the overall system of governing equations was determined by energy method, it was solved by using a symbolic solver—Maple with appropriate boundary conditions. Results from the analytical model were verified with finite element analysis using commercial software ABAQUS. Single-lap composite joint experiments were conducted following ASTM D3165, Strength Properties of Adhesives in Shear by Tension Loading of Single-Lap-Joint Laminated Assemblies. Although all three failure modes of bonded joints, substrate, cohesive, and adhesive failure, were present as the experimental results, the substrate failure mode was the major failure mode observed. Therefore, only substrate failure mode was analyzed using the developed model in the present paper. Four failure criteria, Tsai-Hill failure criterion, von Mises failure criterion, maximum interlaminar tensile stress criterion, and maximum normal stress criterion, were used to correlate the stresses and failure load. Nonlinear regression was conducted to determine the necessary parameters in the failure criteria. Based on the experimental results, thicker bondlines result in weaker joints. The variation of failure load for joints with various bondline thicknesses was consistent with the predicted results.
用ASTM D3165试样对粘接复合接头进行应力和失效分析
建立了单搭接胶接复合材料接头在拉伸作用下的应力应变分布分析模型。在推导中均假定黏着物和黏着物为线弹性。采用层合板理论定义复合材料黏合剂的力学行为,采用线弹性理论描述黏合剂的材料响应。通过这样做,粘合剂中的应力可以随粘合线厚度而变化。在用能量法确定了整个系统的控制方程后,利用具有适当边界条件的符号解算器maple进行求解。利用商业软件ABAQUS对分析模型的结果进行了有限元分析验证。单搭接复合材料接头实验按照ASTM D3165《单搭接层合件在剪切拉伸载荷下的胶粘剂强度特性》进行。虽然实验结果中均存在基材破坏、内聚破坏和粘结破坏三种粘结接头破坏模式,但基材破坏模式是观察到的主要破坏模式。因此,本文仅使用所建立的模型分析衬底的破坏模式。采用Tsai-Hill破坏准则、von Mises破坏准则、最大层间拉应力准则和最大法向应力准则将应力与破坏载荷关联起来。采用非线性回归方法确定了失效准则中的必要参数。实验结果表明,结合线越厚,接头越弱。不同键合线厚度的接头的破坏载荷变化与预测结果一致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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