Pulsed measurements and circuit modeling of a new breakdown mechanism of MESFETs and HEMTs

E. Zanoni, G. Meneghesso, D. Buttari, M. Maretto, G. Massari
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引用次数: 3

Abstract

We measured the on-state breakdown of HEMTs in a nondestructive way using the Transmission Line Pulse technique reaching very high values of gate current density (30 mA/mm). On the basis of the experimental observations, we developed a new model for on-state breakdown of HEMTs, suitable for SPICE simulations, which is capable of predicting the breakdown curves. We have shown that a parasitic bipolar action can give rise in HEMTs to a new form of breakdown, which is accurately modeled by the SPICE equivalent circuit. The model not only predicts I/sub G/, but consistently describes I/sub D/ up to breakdown levels.
mesfet和hemt新型击穿机制的脉冲测量和电路建模
我们使用传输线脉冲技术以非破坏性的方式测量hemt的导通击穿,达到非常高的栅极电流密度(30 mA/mm)。在实验观察的基础上,我们建立了一个适合SPICE模拟的hemt稳态击穿模型,该模型能够预测击穿曲线。我们已经证明,寄生双极作用可以在hemt中引起一种新的击穿形式,这是由SPICE等效电路精确模拟的。该模型不仅可以预测I/sub G/,而且可以一致地描述I/sub D/直至击穿水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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