Modification of Aluminium 6063 Microstructure by Adding Boron and Titanium to Improve the Thermal Conductivity

M. Shaira, Suleiman Yousef
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引用次数: 3

Abstract

This study aimed to improve the thermal conductivity of the Aluminium 6063 for heat sinks applications used in Central Processing Unit (CPU) of computers. Several studies had used different additional elements for this goal. In this paper, we studied the influence of Titanium and Boron addition on the thermal conductivity of Aluminium 6063. Several casting alloys samples were prepared with different percentage of addition elements and then heat-treated by homogenization and aging treatments. The results showed an important modification in thermal conductivity value per rapport to the reference metal, depending on the element of addition and its percentage. The bigger evolution was by using Boron in small percentage. More than 13% of the improvement was realized in the thermal conductivity with the addition of only 0.05% of Boron.
添加硼和钛改性铝6063组织以提高导热性
本研究旨在改善用于计算机中央处理器(CPU)散热器的铝6063的导热性。有几项研究使用了不同的附加因素来实现这一目标。本文研究了钛和硼的加入对铝6063导热性能的影响。制备了几种添加元素含量不同的铸造合金样品,并对其进行了均匀化和时效处理。结果表明,根据添加元素及其百分比的不同,对参考金属的热导率值有重要的变化。更大的进化是通过使用少量的硼。仅添加0.05%的硼,导热系数就提高了13%以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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