Effect of Structural Parameters of Substrate Integrated Waveguide on S-parameter Based on HFSS

Yuxiang Fu, Chunyue Huang, Chao Gao, Ying Liang
{"title":"Effect of Structural Parameters of Substrate Integrated Waveguide on S-parameter Based on HFSS","authors":"Yuxiang Fu, Chunyue Huang, Chao Gao, Ying Liang","doi":"10.1109/ICEPT47577.2019.245793","DOIUrl":null,"url":null,"abstract":"Substrate integrated waveguides (SIW) are widely used in high-speed interconnection technology and it realize high rate data transmission. In this paper, the software of HFSS is used for modeling and simulation of SIW, and the influence of SIW structure parameters on S-parameter is analyzed. Through orthogonal experimental, the main factors which affect S-parameter are obtained. The results show that S11 increases with the increase of the diameter d of the metal through-hole. S11 increases with the increase of metal through hole spacing; S11 decreases with the increase of width of SIW. Metal through hole spacing has a significant influence on S-parameter (S11), which is the main factor affecting s-parameter (S11).","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"4 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245793","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Substrate integrated waveguides (SIW) are widely used in high-speed interconnection technology and it realize high rate data transmission. In this paper, the software of HFSS is used for modeling and simulation of SIW, and the influence of SIW structure parameters on S-parameter is analyzed. Through orthogonal experimental, the main factors which affect S-parameter are obtained. The results show that S11 increases with the increase of the diameter d of the metal through-hole. S11 increases with the increase of metal through hole spacing; S11 decreases with the increase of width of SIW. Metal through hole spacing has a significant influence on S-parameter (S11), which is the main factor affecting s-parameter (S11).
基于HFSS的衬底集成波导结构参数对s参数的影响
衬底集成波导(SIW)广泛应用于高速互连技术,实现了高速数据传输。本文利用HFSS软件对SIW进行建模和仿真,分析了SIW结构参数对s参数的影响。通过正交试验,得出了影响s参数的主要因素。结果表明:S11随金属通孔直径d的增大而增大;S11随金属通孔间距的增大而增大;S11随SIW宽度的增加而减小。金属通孔间距对s参数(S11)有显著影响,是影响s参数(S11)的主要因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信