TCAD simulation of the nitrogen effect by NO-nitrided oxide

Kyong-Ha Lee, Junseok Lee, Hyun-Cheol Kim, J. Hwang
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Abstract

Anomalous short channel characteristics in NO-nitrided gate oxide device were investigated in this paper. In NMOS, the NO-nitrided gate oxide device has less reverse short-channel effect with lower threshold voltage than pure gate oxide device. On the other hand, the opposite case is seen for PMOS. These characteristics are attributed to the boron dose loss in surface region by NO-nitrided oxidation in SIMS analysis. By these results, we can apply nitrogen effect by NO-nitrided oxide to the simulation using interface trap model in TSUPREM-4. We can optimize the NO anneal condition of 0.18 /spl mu/m technology by simulation.
no -氮化氧化物氮化效应的TCAD模拟
研究了no -氮化栅氧化器件的异常短沟道特性。在NMOS中,氮化栅极氧化物器件比纯栅极氧化物器件具有更小的反向短沟道效应和更低的阈值电压。另一方面,PMOS的情况正好相反。这些特征归因于氮化氧化在SIMS分析中的表面硼剂量损失。通过这些结果,我们可以将no -氮化氧化物的氮效应应用到TSUPREM-4界面阱模型的模拟中。通过仿真对0.18 /spl mu/m工艺的NO退火条件进行了优化。
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