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DETECTION OF BONDING DEFECT IN MULTIMATERIALS SANDWICH STRUCTURES USING THERMOGRAPHY AND NUMERICAL SIMULATION PREDICTION

IF 0.3 Q4 MECHANICS
Composites-Mechanics Computations Applications Pub Date : 2020-01-01 DOI:10.1615/compmechcomputapplintj.2020034873
K. Wongtimnoi, Pisak Chermprayong, L. Mezeix
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基于热成像和数值模拟预测的多材料夹层结构粘结缺陷检测
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来源期刊
Composites-Mechanics Computations Applications
Composites-Mechanics Computations Applications MECHANICS-
CiteScore
0.60
自引率
0.00%
发文量
24
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